| Axiom Microdevices to Participate in the CALTECH RF and Microwave Seminar Series |
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Rahul Magoon, director of engineering, to present on “The CMOS Power Amplifier as a Path to the Single Chip Phone” IRVINE, Calif., Oct. 17, 2007 — Axiom Microdevices Inc., provider of the world’s first and only fully integrated complementary metal oxide semiconductor power amplifiers (CMOS PA) for mobile handsets, announced today that its director of engineering, Rahul Magoon, will deliver a technical presentation at the CALTECH RF and Microwave Seminar Series on Friday, Oct. 19.Who Rahul Magoon, director of engineering at Axiom Microdevices, has 12 years of experience in the research and development of radio frequency integrated circuits (RFIC) for cellular applications. Magoon has been with Axiom Microdevices since its inception in 2002 as a member of the initial founding group and has played a key role in the development and market introduction of Axiom Microdevices’ AX502 CMOS PA. This award-winning technology enables handset manufacturers to take advantage of the industry’s investments in mainstream CMOS processes and provides for better long-term integration by removing the need for specialty gallium arsenide (GaAs) technologies. Magoon holds a bachelor of technology in electrical engineering from the Indian Institute of Technology, Bombay and a Master of Science degree in electrical engineering from the University of California, Santa Barbara. What The CALTECH RF and Microwave Seminar Series focuses on recent developments in analog and mixed-signal circuit design, electromagnetics, integrated sensors, biosensors and technology trends in integrated systems. Events are held periodically throughout the school year, on the CALTECH campus in Pasadena, Calif. As an invited presenter, Magoon will demonstrate how Axiom Microdevices’ CMOS PA heralds a paradigm shift in the way that radios will be partitioned in the future. Why Axiom Microdevices’ award-winning CMOS PA integrates full quad-band GSM/GPRS functionality on a single integrated circuit, using mainstream 0.13um silicon CMOS technology. This patented technology enables integration of the PA output match on die along with the power control function, eliminating the need for complex and expensive multi-chip module technology based on GaAs or other specialty processes. With the implementation in Silicon of the last component of the phone, Axiom has opened up the path to integration of the entire radio function on die. This re-partitioning of the cellular system will result in significant future opportunities in cost reduction due to architecture simplification and hardware reuse as well as allow the implementation of reconfigurable radios that can adapt to their operating modes. Axiom Microdevices is now shipping over a million PAs a month as it continues to ramp its production at multiple customers and in multiple handsets. When and Where Magoon’s presentation, as part of the CALTECH RF and Microwave Seminar Series will be held on Friday, Oct. 19, 2007 at 4 p.m., Room 080 Moore, 1200 E. California Blvd., Pasadena, CA 91125. |
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